Raytheon, one of the largest defense contractors in the United States, has signed a contract to develop a "multi-chip" package. The company is collaborating with AMD to improve real-time data processing for military operations. The contract is worth $20 million.
The main goal is to develop a next-generation multi-chip package for use in ground, sea, and airborne sensors. Under the agreement, Raytheon will utilize advanced commercial devices from industry partners such as AMD to create compact microelectronic solutions. They will convert radio frequency energy into digital information with higher bandwidth and faster data transfer rates. The integration will result in new system capabilities, providing higher performance, reduced power consumption, and reduced weight.
"By collaborating with the commercial industry, we can implement advanced technologies into Department of Defense applications much more quickly. Together, we will create the first multi-chip package with cutting-edge interconnect capabilities, delivering new system capabilities to our warfighters," Raytheon said in a statement.
This multi-chip package will be created using state-of-the-art interconnect standards at the chip level, allowing individual chiplets to achieve maximum performance and implement new system capabilities in an economically efficient and high-performance manner. It is designed to meet Raytheon's scalable sensor processing requirements.
Chiplets from commercial partners will be integrated into an intermediate converter developed and manufactured by Raytheon using the 3D Universal Packaging (3DUP) production process.
Source: wccftech
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